TSMC breaks ground on 3rd fabrication facility in Phoenix

PHOENIX — The Taiwan Semiconductor Manufacturing Company has started construction on a third semiconductor fabrication facility in Phoenix.

The new TSMC facility broke ground as the company has invested over $165 billion in the three Phoenix facilities.

U.S. Secretary of Commerce Howard Lutnick joined the groundbreaking event on Tuesday. 

The facility will create semiconductor chips that will help advance artificial intelligence, data centers and smartphones in the U.S, according to a Tuesday news release.

“As part of our commitment to support the needs of America’s leading innovators in smartphones, HPC and AI, we recently broke ground on our third fab, which will introduce more advanced semiconductor capacity to the United States,” TSMC Chairman and CEO Dr. C.C. Wei said in the release.

“We are grateful for the secretary’s commitment to supporting the advanced semiconductor manufacturing ecosystem.”

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